Mobile key parts

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  • uMCP

    uMCP

    Specifications & Features

    uMCP (universal Multi-Chip Package) is an advanced packaging technology that integrates LPDDR memory and UFS storage into a single, compact package. It is designed for mobile devices, IoT applications, and other space-constrained systems where performance, power efficiency, and miniaturization are critical.

    Application

    Mobile devices, IoT applications, and other space-constrained systems

    End Users

    Samsung, Huawei, Xiaomi, OPPO, VIVO, Apple, Samsung, SKhynix, Micron

  • UFS

    UFS

    Specifications & Features

    UFS (Universal Flash Storage) is a high-performance storage standard designed for mobile devices, automotive systems, and IoT devices. It offers significant improvements over older storage technologies like eMMC (embedded MultiMediaCard) in terms of speed, power efficiency, and reliability.

    Application

    Mobile Devices, Automotive Systems

    End Users

    Apple, Samsung, Huawei, Xiaomi, OPPO, VIVO, Longsys, Kioxia, Micron, SKhynix

  • LPDDR

    LPDDR

    Specifications & Features

    LPDDR (Low Power Double Data Rate) memory is a type of DRAM specifically designed for mobile and low-power devices. It is widely used in smartphones, tablets, laptops, and other portable electronics due to its high performance and energy efficiency.

    Application

    Smartphone, Notebook, Tablet, Automotives

    End Users

    Apple, Lenovo, HP, Dell, Samsung, Xiaomi, OPPO, VIVO

  • Automotives & Others

    Automotives & Others

    Specifications & Features

    Automotive semiconductor components are critical elements in modern vehicles, enabling advanced features such as electrification, connectivity, safety, and automation. These components are designed to withstand harsh automotive environments, including extreme temperatures, vibrations, and electromagnetic interference. Memorys, FPGAs & ASICs, MCUs, Sensors, Mosfets, IGBTs

    Application

    Memorys, FPGAs & ASICs, MCUs, Sensors, Mosfets, IGBTs, SiC, BMS. Major Automotive Semiconductor Suppliers: Infineon Technologies, NXP Semiconductors, Renesas Electronics, STMicroelectronics, Texas Instruments, ON Semiconductor, Bosch, Analog Devices, Microchip Technology, Qualcomm

    End Users

    Bosch, Tesla, BYD, Xiaomi, Toyota, BMW, Benz, Volkswagon