Specifications & Features
uMCP (universal Multi-Chip Package) is an advanced packaging technology that integrates LPDDR memory and UFS storage into a single, compact package. It is designed for mobile devices, IoT applications, and other space-constrained systems where performance, power efficiency, and miniaturization are critical.
Application
Mobile devices, IoT applications, and other space-constrained systems
End Users
Samsung, Huawei, Xiaomi, OPPO, VIVO, Apple, Samsung, SKhynix, Micron
Specifications & Features
UFS (Universal Flash Storage) is a high-performance storage standard designed for mobile devices, automotive systems, and IoT devices. It offers significant improvements over older storage technologies like eMMC (embedded MultiMediaCard) in terms of speed, power efficiency, and reliability.
Application
Mobile Devices, Automotive Systems
End Users
Apple, Samsung, Huawei, Xiaomi, OPPO, VIVO, Longsys, Kioxia, Micron, SKhynix
Specifications & Features
LPDDR (Low Power Double Data Rate) memory is a type of DRAM specifically designed for mobile and low-power devices. It is widely used in smartphones, tablets, laptops, and other portable electronics due to its high performance and energy efficiency.
Application
Smartphone, Notebook, Tablet, Automotives
End Users
Apple, Lenovo, HP, Dell, Samsung, Xiaomi, OPPO, VIVO
Specifications & Features
Automotive semiconductor components are critical elements in modern vehicles, enabling advanced features such as electrification, connectivity, safety, and automation. These components are designed to withstand harsh automotive environments, including extreme temperatures, vibrations, and electromagnetic interference. Memorys, FPGAs & ASICs, MCUs, Sensors, Mosfets, IGBTs
Application
Memorys, FPGAs & ASICs, MCUs, Sensors, Mosfets, IGBTs, SiC, BMS. Major Automotive Semiconductor Suppliers: Infineon Technologies, NXP Semiconductors, Renesas Electronics, STMicroelectronics, Texas Instruments, ON Semiconductor, Bosch, Analog Devices, Microchip Technology, Qualcomm
End Users
Bosch, Tesla, BYD, Xiaomi, Toyota, BMW, Benz, Volkswagon