HBM， High bandwidth memory is an innovative memory chip designed to overcome the limitations of traditional memory bandwidth. By adopting cutting-edge packaging technologies such as TSV through silicon technology, HBM is able to vertically integrate multiple DRAM chips, providing high bandwidth and enormous memory capacity. This technology has become a hot topic in the current technological field, attracting the attention of numerous researchers and engineers.

Next, we will delve into the working principle of HBM and analyze the reasons why it has attracted so much attention.

The birth of HBM technology undoubtedly brings disruptive changes to the storage field. Its innovative 3D stacking design enables multi-layer DRAM chips to be vertically stacked and tightly connected through through silicon via (TSV) and micro bump (uBump) technology, thereby constructing a massive storage stack. This design not only significantly improves storage density, but also greatly increases the capacity and bit width of each storage stack.

HBM technology has emerged in the storage field with its unique characteristics and advantages: its high bandwidth solves the problem of insufficient bandwidth in traditional DRAM, large capacity storage meets the needs of big data and high-performance computing, low latency benefits from TSV technology connecting multiple DRAM chips, and low-power design ensures the dual advantages of high performance and energy saving.

HBM technology is mainly applied in high-performance computing and big data processing fields, especially playing a crucial role in AI servers and GPUs. With the rapid development of AI technology, the demand for computing power has sharply increased. HBM, with its high bandwidth and large capacity characteristics, has become a key technology to break through memory bottlenecks. For example, high-end AI server GPUs are typically equipped with HBM memory to meet the challenges of large-scale training.

Looking ahead, the HBM market is expected to continue to thrive, especially in the field of AI driven high-performance computing. According to TrendForce's forecast, the HBM market size is expected to exceed $10 billion by 2025. In order to meet the growing market demand, major manufacturers such as Samsung and SK Hynix are actively developing new generation HBM technologies, such as HBM4.