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HBM， High bandwidth memory is an innovative memory chip designed to overcome the limitations of traditional memory bandwidth. By adopting cutting-edge packaging technologies such as TSV through silicon technology, HBM is able to vertically integrate multiple DRAM chips, providing high bandwidth and enormous memory capacity. This technology has become a hot topic in the current technological field,...
In recent years, with the rise of AI, a storage chip with high bandwidth and low power consumption characteristics - HBM chip - has also become popular, including NVIDIA H100, AMD MI300, etc. Now, Samsung plans to further expand the use of HBM chips and bring them to the mobile phone market.
According to an interview conducted by South Korean media SEDaily at the IEEE ISSCC 2025 International Solid State Circuit Conference, Samsung Electronics unveiled its HBM memory roadmap at the conference.